Scope:
1. Environmental and Reliability Testing
(JEDEC JESD47, JESD22 Series, JESD89-1/2/3, JESD201, JS-001, JS002, J-STD-020, J-STD-035,
JESD78, JP001, J-STD-002, J-STD-003, JIS K5600-5-4, AEC-Q100 Series, AEC-Q101 Series, AEC-Q200
Series, AEC-Q005, ASTM Series, EIAJ ED-4701 Series / EIA 364 Series, EIAJ-4702 Series, SAE J1752-2 /
J1752-3, IEC 62137-1-2, IEC 61000-4-2, IEC60068 Series / IPC-TM-650, IPC-A-600, IPC-A-610, IPC-6012,
IPC-9708, ANSI/ESDA STM5.1/5.2/5.3, MIL-STD-810 , MIL-STD-883 , MIL-STD-750 , MIL-STD-202 , MILSTD-
1344 )
Including tests of:
File No 1.72.0031
&C
Task Ref 15 - 1 Report Date: 2015-7-23 Page 3 of 3
GAD-00-01 Rev 19.1
Preconditioning of non-hermetic Surface Mount Device prior to reliability testing(PC), Steady State Bias
Temperature and Humidity Bias Life(THB/H3TRB), Highly Accelerated Temperature and Humidity Stress
Test (HAST, JESD22A-110), Accelerated Moisture Resistance-Unbiased Autoclave(AC/PCT), Accelerated
Moisture Resistance-Unbiased HAST(UHAST), Temperature Cycling(TCT), Thermal Shock(TST), Power
and Temperature Cycling(PTC), High Temperature Storage Life(HTSL), Low Temperature Storage
Life(LTSL), Temperature Bias and Operating Life (HTOL/LTOL/HTGB/HTRB/HTFB/ELFR/IOL, JESD22-
A108/AECQ100-008), Non-Volatile Memory Program/Erase Endurance, Data Retention and Operating Life
Test (Endurance/Data Retention), Wire bonding and solder ball integrity test(WBS/WBP/SBS),
Solderability(SD), Physical Dimensions(PD), Lead Integrity(LI), Bond Strength, Electrostatic discharge
test(HBM/MM/CDM), Latch-up(LU), IC EMC test(EMC), Gate Leakage test(GL), Soft Error
Rate(SSER/ASER), Short Circuit(SC), PB-Free test(LF), Gross and fine leak(GFL), Lead Torque(LT), Die
Shear(DS), External Visual(EV), Terminal Strength(TS), Twist, Durability, Push/Pull, Abrasion
Resistance(RCA), Film Hardness by Pencil, Resistance to Solvents(RTS), Resistance to Soldering
Heat(RSH), Flame Retardance, Flammability, Mechanical Shock(MS), Vibration Variable Frequency (VVF),
Dielectric Integrity(DI), Electrical Migration(EM), Salt, Gas Corrosion.
2. Failure analysis and material analysis of semiconductor integrated circuits, electronic components and
PCB/PCBA, including FIB (Focused Ion Beam), Electrical Analysis, Sample Preparation (Decap, Delayer,
Cross-section, COB, etc), NDE (Non-destructive Engineering), Physical & Chemical Analysis (Including
Hazardous Substances) and IC package.
3. 2nd Level Integration Platform Service
(JESD22 Series, AEC-Q200 Series, IPC-9701, IPC-9704, EIAJ-4702 Series,
IEC60068 Series, SEMI G86-03, IPC-7525B, IPC-610 Series)
Including test of :
SMT and 2nd reliability Services: Temperature Cycling (IPC 9701/JESD22 A104), Board Level Drop
(JESD22 B104/B111), Shock Test, Vibration Test, Bending Test (Cyclic bend, Monotonic bend (IPC 9702),
Chip and Die Strength, Pull/Push Test and SMT and PCBA test (Cold ball pull test, wire pull test, ball shear
test and hot bond pull test, Stencil Design, Solderability(SD)
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